Inventor · disambiguated record
Toshihiko Isokawa
Also filed as: ISOKAWA TOSHIHIKO
3 granted patents·287 citations·filing 2002–2004
79Inventor score
Top patents by PatentIndex Score
3 records- 0193US7180149B2Semiconductor package with through-holeOLYMPUS CORP·Filed 2004·Granted Feb 20, 2007·110 cites·11 claims
- 0293US7022609B2Manufacturing method of a semiconductor substrate provided with a through hole electrodeOLYMPUS OPTICAL CO·Filed 2003·Granted Apr 4, 2006·101 cites·12 claims
- 0387US6949996B2ActuatorOLYMPUS CORP·Filed 2002·Granted Sep 27, 2005·76 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →