Inventor · disambiguated record
Andrew Camien
Also filed as: CAMIEN ANDREW · CAMIEN ANDREW N · CAMIEN ANDREW NELSON
8 granted patents·3 pending applications·556 citations·filing 1996–2010
91Inventor score
Top patents by PatentIndex Score
11 records- 0192US7127807B2Process of manufacturing multilayer modulesIRVINE SENSORS CORP·Filed 2003·Granted Oct 31, 2006·69 cites·5 claims
- 0291US6117704AStackable layers containing encapsulated chipsIRVINE SENSORS CORP·Filed 1999·Granted Sep 12, 2000·137 cites·15 claims
- 0391US5953588AStackable layers containing encapsulated IC chipsIRVINE SENSORS CORP·Filed 1996·Granted Sep 14, 1999·128 cites·14 claims
- 0490US6072234AStack of equal layer neo-chips containing encapsulated IC chips of different sizesIRVINE SENSORS CORP·Filed 1999·Granted Jun 6, 2000·105 cites·33 claims
- 0588US6560109B2Stack of multilayer modules with heat-focusing metal layerIRVINE SENSORS CORP·Filed 2001·Granted May 6, 2003·44 cites·10 claims
- 0683US6734370B2Multilayer modules with flexible substratesIRVINE SENSORS CORP·Filed 2001·Granted May 11, 2004·32 cites·13 claims
- 0780US7786562B2Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2005·Granted Aug 31, 2010·11 cites·34 claims
- 0880US6717061B2Stacking of multilayer modulesIRVINE SENSORS CORP·Filed 2001·Granted Apr 6, 2004·30 cites·3 claims
- 0941US2010291735A1Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2010·Application pending·0 cites
- 1037US2003049889A1Method of manufacturing multilayer modulesFiled 2001·Application pending·0 cites
- 1135US2004113222A1Stacked microelectronic module with vertical interconnect viasOZGUZ VOLKAN H·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →