Inventor · disambiguated record
Ameya Limaye
Also filed as: LIMAYE AMEYA · LIMAYE AMEYA S
5 granted patents·5 pending applications·5 citations·filing 2009–2024
67Inventor score
Top patents by PatentIndex Score
10 records- 0171US10712789B2Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperatureINTEL CORP·Filed 2015·Granted Jul 14, 2020·2 cites·20 claims
- 0264US8941236B2Using collapse limiter structures between elements to reduce solder bump bridgingLIMAYE AMEYA·Filed 2012·Granted Jan 27, 2015·3 cites·16 claims
- 0361US2024407127A1Airflow distribution to cool memory module shadowed by the processorINTEL CORP·Filed 2024·Application pending·0 cites
- 0461US2025008637A1Isolation and protection of computing components from liquid immersion cooling fluidsCARTE CASEY JAMESEN·Filed 2024·Application pending·0 cites
- 0559US11320877B2Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperatureINTEL CORP·Filed 2020·Granted May 3, 2022·0 cites·22 claims
- 0650US2009250828A1Method for Making Ophthalmic Devices Using Single Mold StereolithographyROSEN DAVID WILLIAM·Filed 2009·Application pending·0 cites
- 0744US2021320048A1Cold plate with integrated vapor chamberINTEL CORP·Filed 2021·Application pending·0 cites
- 0842US10181432B2Computing system with a thermal interface comprising magnetic particlesINTEL CORP·Filed 2017·Granted Jan 15, 2019·0 cites·8 claims
- 0937US10177066B2Flexible integrated heat spreaderINTEL CORP·Filed 2017·Granted Jan 8, 2019·0 cites·16 claims
- 1031US2014151096A1Low temperature/high temperature solder hybrid solder interconnectsJIANG HONGJIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →