Inventor · disambiguated record
Lee Kian Chai
Also filed as: CHAI LEE KIAN
10 granted patents·230 citations·filing 2001–2007
91Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC10
Top patents by PatentIndex Score
10 records- 0193US6507114B2BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the dieMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·87 cites·35 claims
- 0289US6638792B2Method for fabricating BOC semiconductor packageMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 28, 2003·74 cites·23 claims
- 0384US7208828B2Semiconductor package with wire bonded stacked dice and multi-layer metal bumpsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 24, 2007·17 cites·9 claims
- 0477US7202556B2Semiconductor package having substrate with multi-layer metal bumpsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 10, 2007·21 cites·24 claims
- 0575US7465488B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 16, 2008·5 cites·22 claims
- 0663US7550315B2Method for fabricating semiconductor package with multi-layer die contact and external contactMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 23, 2009·2 cites·14 claims
- 0763US7253022B2Method for fabricating semiconductor package with multi-layer metal bumpsMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 7, 2007·9 cites·28 claims
- 0855US6781248B2Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packagedMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·10 cites·113 claims
- 0953US7161236B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 9, 2007·4 cites·36 claims
- 1045US7235872B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 26, 2007·1 cites·59 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →