Inventor · disambiguated record
Heimo Scheucher
Also filed as: SCHEUCHER HEIMO
14 granted patents·2 pending applications·39 citations·filing 2002–2015
89Inventor score
Top patents by PatentIndex Score
16 records- 0175US8264092B2Integrated circuits on a wafer and method of producing integrated circuitsSCHEUCHER HEIMO·Filed 2008·Granted Sep 11, 2012·5 cites·13 claims
- 0272US9798228B2Maximizing potential good die per wafer, PGDWNXP BV·Filed 2015·Granted Oct 24, 2017·3 cites·14 claims
- 0369US9754832B2Semiconductor wafer and method of producing the sameSCHMITT FLORIAN·Filed 2012·Granted Sep 5, 2017·3 cites·19 claims
- 0469US8701077B1Individual ROM codes on a single reticle for a plurality of devicesNXP BV·Filed 2012·Granted Apr 15, 2014·4 cites·16 claims
- 0562US7884722B2Data carrier comprising strain gauge meansNXP BV·Filed 2007·Granted Feb 8, 2011·2 cites·17 claims
- 0661US8349708B2Integrated circuits on a wafer and methods for manufacturing integrated circuitsNXP BV·Filed 2008·Granted Jan 8, 2013·1 cites·12 claims
- 0759US9620456B2Integrated circuits on a wafer and methods for manufacturing integrated circuitsSCHEUCHER HEIMO·Filed 2008·Granted Apr 11, 2017·1 cites·15 claims
- 0855US7456489B2Wafer with optical control modules in IC fieldsNXP BV·Filed 2004·Granted Nov 25, 2008·5 cites·4 claims
- 0954US9318428B2Chip having two groups of chip contactsSCHEUCHER HEIMO·Filed 2005·Granted Apr 19, 2016·1 cites·20 claims
- 1053US8415769B2Integrated circuits on a wafer and method for separating integrated circuits on a waferSCHEUCHER HEIMO·Filed 2008·Granted Apr 9, 2013·1 cites·17 claims
- 1152US6680523B2Semiconductor wafer with process control modulesFiled 2002·Granted Jan 20, 2004·4 cites·4 claims
- 1251US7247943B2Integrated circuit with at least one bumpNXP BV·Filed 2003·Granted Jul 24, 2007·5 cites·7 claims
- 1348US7508051B2Wafer with optical control modules in dicing pathsNXP BV·Filed 2004·Granted Mar 24, 2009·2 cites·2 claims
- 1445US2007086605A1Electro-acoustic transducer comprising an rfid circuitKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Application pending·0 cites
- 1539US2008067509A1Chip Comprising at Least One Test Contact ConfigurationKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1636US7538444B2Wafer with optical control modules in exposure fieldsSCHEUCHER HEIMO·Filed 2004·Granted May 26, 2009·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →