Inventor · disambiguated record
Wolfram Drescher
Also filed as: DRESCHER WOLFRAM
25 granted patents·10 pending applications·54 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
35 records- 0192US10593590B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2019·Granted Mar 17, 2020·2 cites·15 claims
- 0291US11004723B2Wafer production methodSILTECTRA GMBH·Filed 2020·Granted May 11, 2021·2 cites·20 claims
- 0389US10978311B2Method for thinning solid body layers provided with componentsSILTECTRA GMBH·Filed 2017·Granted Apr 13, 2021·5 cites·20 claims
- 0482US10312135B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2014·Granted Jun 4, 2019·3 cites·15 claims
- 0582US2023307286A1Method for Producing a Layer of Solid MaterialSILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 0678US10141219B2Combined production method for separating a number of thin layers of solid material from a thick solid bodySilectra GmbH·Filed 2014·Granted Nov 27, 2018·4 cites·6 claims
- 0777US10843380B2Method for the material-saving production of wafers and processing of wafersSILTECTRA GMBH·Filed 2016·Granted Nov 24, 2020·2 cites·9 claims
- 0875US11699616B2Method for producing a layer of solid materialSILTECTRA GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 0971US7685439B2Method for effecting the controlled shutdown of data processing unitsNXP BV·Filed 2003·Granted Mar 23, 2010·20 cites·6 claims
- 1070US11518066B2Method of treating a solid layer bonded to a carrier substrateSILTECTRA GMBH·Filed 2020·Granted Dec 6, 2022·0 cites·16 claims
- 1170US10825732B2Method of producing stresses in a semiconductor waferSILTECTRA GMBH·Filed 2020·Granted Nov 3, 2020·0 cites·20 claims
- 1267US12211702B2Solid body and multi-component arrangementSILTECTRA GMBH·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 1364US11201081B2Method for separating thin layers of solid material from a solid bodySILTECTRA GMBH·Filed 2019·Granted Dec 14, 2021·0 cites·18 claims
- 1462US10580699B1Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 1561US10304738B2Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2018·Granted May 28, 2019·0 cites·9 claims
- 1657US10269643B2Method and device for the production of wafers with a pre-defined break initiation pointSILTECTRA GMBH·Filed 2014·Granted Apr 23, 2019·0 cites·14 claims
- 1757US2019096746A1Combined production mehtod for separating a number of thin layers of solid material from a thick solid bodySILTECTRA GMBH·Filed 2018·Application pending·0 cites
- 1855US7647445B2Processor bus arrangementNXP BV·Filed 2001·Granted Jan 12, 2010·4 cites·8 claims
- 1953US8665935B2Method and system for calibrating a transmitting systemDRESCHER WOLFRAM·Filed 2006·Granted Mar 4, 2014·1 cites·20 claims
- 2053US7779229B2Method and arrangement for bringing together data on parallel data pathsNXP BV·Filed 2003·Granted Aug 17, 2010·3 cites·7 claims
- 2152US8391269B2Method and system for transmitting data from a medium access control device via a physical layer to an antennaDRESCHER WOLFRAM·Filed 2006·Granted Mar 5, 2013·1 cites·12 claims
- 2252US7003538B2Process and apparatus for finite field multiplication (FFM)SYSTEMONIC AG·Filed 2002·Granted Feb 21, 2006·3 cites·25 claims
- 2349US6871256B2Method and arrangement in a stack having a memory segmented into data groups having a plurality of elementsSYSTEMONIC AG·Filed 2002·Granted Mar 22, 2005·3 cites·21 claims
- 2447US10029277B2Method of producing large-scale layers of solid materialSILTECTRA GMBH·Filed 2014·Granted Jul 24, 2018·0 cites·1 claims
- 2547US2018118562A1Method for the low-loss production of multi-component wafersSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 2646US7577818B2Microprocessor program addressing arrangement having multiple independent complete address generatorsNXP BV·Filed 2002·Granted Aug 18, 2009·1 cites·9 claims
- 2746US2009268794A1Communication system and method for operating a communication systemNXP BV·Filed 2007·Application pending·0 cites
- 2845US10229835B2Splitting method and use of a material in a splitting methodSILTECTRA GMBH·Filed 2015·Granted Mar 12, 2019·0 cites·22 claims
- 2944US2009164821A1Method and a system for controlling a sleep mode of a device in a wireless communications network or in a mobile point-to-point connectionNXP BV·Filed 2006·Application pending·0 cites
- 3043US2017362697A1Transparent and highly stable screen protectorSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 3142US2008215851A1Method and arrangement for the power-efficient control of processorsPORST UWE·Filed 2008·Application pending·0 cites
- 3241US7143211B2Memory configuration with I/O supportSYSTEMONIC AG·Filed 2001·Granted Nov 28, 2006·0 cites·7 claims
- 3341US2004044818A1Data path arrangementFiled 2001·Application pending·0 cites
- 3440US2003005264A1Device and method for control of the data streamFiled 2000·Application pending·0 cites
- 3535US2007150701A1Method and arrangement for power-efficient control of processorsPORST UWE·Filed 2003·Application pending·0 cites
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