Inventor · disambiguated record
Nam-Gyu Baek
Also filed as: BAEK NAM-GYU
9 granted patents·2 pending applications·27 citations·filing 2013–2019
84Inventor score
Top patents by PatentIndex Score
11 records- 0191US10304781B2Semiconductor devices including guard ring and crack sensing circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·7 cites·18 claims
- 0290US9698066B2Semiconductor chips having defect detecting circuitsLEE BO-RA·Filed 2016·Granted Jul 4, 2017·10 cites·20 claims
- 0387US10490514B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 26, 2019·4 cites·15 claims
- 0475US9984945B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 29, 2018·2 cites·8 claims
- 0574US10103109B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·19 claims
- 0671US10643958B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 0763US9202794B2Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 1, 2015·1 cites·13 claims
- 0848US9570411B2Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·19 claims
- 0946US11158589B2Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 1041US2020035649A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1140US2019139921A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Nam-Gyu Baek files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →