Inventor · disambiguated record
Kenzou Hatada
Also filed as: HATADA KENZOU
4 granted patents·363 citations·filing 1990–1999
83Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD4
Top patents by PatentIndex Score
4 records- 0197US5945834ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 31, 1999·160 cites·7 claims
- 0296US6005401ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 21, 1999·140 cites·8 claims
- 0380US6323663B1Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·37 cites·7 claims
- 0452US5037780AMethod for attaching semiconductors to a transparent substrate using a light-curable resinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Aug 6, 1991·26 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →