Inventor · disambiguated record
Mira Ben-Tzur
Also filed as: BEN-TZUR MIRA
14 granted patents·105 citations·filing 2000–2004
92Inventor score
Files withCYPRESS SEMICONDUCTOR CORP14
Top patents by PatentIndex Score
14 records- 0176US7026235B1Dual-damascene process and associated floating metal structuresCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Apr 11, 2006·23 cites·16 claims
- 0269US6903002B1Low-k dielectric layer with air gapsCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Jun 7, 2005·16 cites·8 claims
- 0366US6713831B1Borderless contact architectureCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Mar 30, 2004·12 cites·19 claims
- 0463US6774033B1Metal stack for local interconnect layerCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Aug 10, 2004·11 cites·17 claims
- 0561US6660661B1Integrated circuit with improved RC delayCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Dec 9, 2003·8 cites·18 claims
- 0658US6835616B1Method of forming a floating metal structure in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Dec 28, 2004·8 cites·10 claims
- 0757US6841878B1Integrated circuit with improved RC delayCYPRESS SEMICONDUCTOR CORP·Filed 2003·Granted Jan 11, 2005·6 cites·12 claims
- 0853US6911395B1Method of making borderless contacts in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 2000·Granted Jun 28, 2005·8 cites·17 claims
- 0951US6844235B1Reticle repeater monitor wafer and method for verifying reticlesCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Jan 18, 2005·3 cites·20 claims
- 1049US7227212B1Method of forming a floating metal structure in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 2004·Granted Jun 5, 2007·4 cites·3 claims
- 1149US6977217B1Aluminum-filled via structure with barrier layerCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Dec 20, 2005·4 cites·9 claims
- 1240US7018942B1Integrated circuit with improved RC delayCYPRESS SEMICONDUCTOR CORP·Filed 2004·Granted Mar 28, 2006·0 cites·20 claims
- 1339US7192867B1Protection of low-k dielectric in a passivation levelCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Mar 20, 2007·1 cites·13 claims
- 1438US6939792B1Low-k dielectric layer with overlying adhesion layerCYPRESS SEMICONDUCTOR CORP·Filed 2003·Granted Sep 6, 2005·1 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Mira Ben-Tzur files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →