Inventor · disambiguated record

Yi-Mang Chou

Also filed as: CHOU YI-MANG

1 granted patent·1 pending application·0 citations·filing 2011–2011

4Inventor score

Technology areasH10W

Files withCHOU YI-MANG2

Top patents by PatentIndex Score

2 records

0123US9053943B2Bond pad design for improved routing and reduced package stressCHOU YI-MANG·Filed 2011·Granted Jun 9, 2015·0 cites·20 claims
0223US2012329263A1Method of forming a bond pad design for improved routing and reduced package stressCHOU YI-MANG·Filed 2011·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →