Inventor · disambiguated record

Jack Chang-Chien

Also filed as: CHANG-CHIEN JACK

2 granted patents·4 citations·filing 2006–2006

41Inventor score

Technology areasH05K H10W

Files withCHIU CHIN-TIEN1 SANDISK CORP1

Top patents by PatentIndex Score

2 records

0166US7435624B2Method of reducing mechanical stress on a semiconductor die during fabricationSANDISK CORP·Filed 2006·Granted Oct 14, 2008·4 cites·15 claims
0240US8878346B2Molded SiP package with reinforced solder columnsCHIU CHIN-TIEN·Filed 2006·Granted Nov 4, 2014·0 cites·24 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →