Inventor · disambiguated record
Dokok Yu
Also filed as: YU DOKOK
2 granted patents·6 citations·filing 2011–2012
51Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0167US9142481B2Integrated circuit packaging system with heatsink cap and method of manufacture thereofKIM GWANGJIN·Filed 2012·Granted Sep 22, 2015·4 cites·9 claims
- 0264US8524538B2Integrated circuit packaging system with film assistance mold and method of manufacture thereofLEE JAEHYUN·Filed 2011·Granted Sep 3, 2013·2 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →