Inventor · disambiguated record
Gary Long
Also filed as: LONG GARY · LONG GARY B · LONG GARY BAXTER
22 granted patents·5 pending applications·384 citations·filing 2001–2016
96Inventor score
Top patents by PatentIndex Score
27 records- 0195US6747216B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryINTEL CORP·Filed 2002·Granted Jun 8, 2004·52 cites·10 claims
- 0294US7022919B2Printed circuit board trace routing methodINTEL CORP·Filed 2003·Granted Apr 4, 2006·81 cites·14 claims
- 0392US6916183B2Array socket with a dedicated power/ground conductor busINTEL CORP·Filed 2003·Granted Jul 12, 2005·70 cites·30 claims
- 0487US7630601B2Connecting a component with an embedded optical fiberINTEL CORP·Filed 2008·Granted Dec 8, 2009·12 cites·17 claims
- 0584US6882762B2Waveguide in a printed circuit board and method of forming the sameINTEL CORP·Filed 2001·Granted Apr 19, 2005·33 cites·29 claims
- 0681US6992899B2Power delivery apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jan 31, 2006·31 cites·21 claims
- 0779US7361842B2Apparatus and method for an embedded air dielectric for a package and a printed circuit boardINTEL CORP·Filed 2005·Granted Apr 22, 2008·11 cites·15 claims
- 0879US7043706B2Conductor trace design to reduce common mode cross-talk and timing skewINTEL CORP·Filed 2003·Granted May 9, 2006·24 cites·23 claims
- 0976US7843057B2Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the methodINTEL CORP·Filed 2005·Granted Nov 30, 2010·5 cites·5 claims
- 1075US6642158B1Photo-thermal induced diffusionINTEL CORP·Filed 2002·Granted Nov 4, 2003·13 cites·10 claims
- 1173US7373068B2Connecting a component with an embedded optical fiberINTEL CORP·Filed 2006·Granted May 13, 2008·5 cites·11 claims
- 1273US7269899B2Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryINTEL CORP·Filed 2003·Granted Sep 18, 2007·11 cites·8 claims
- 1369US7343576B2Conductor trace design to reduce common mode cross-talk and timing skewINTEL CORP·Filed 2005·Granted Mar 11, 2008·3 cites·9 claims
- 1468US7145243B2Photo-thermal induced diffusionINTEL CORP·Filed 2003·Granted Dec 5, 2006·9 cites·6 claims
- 1568US7064063B2Photo-thermal induced diffusionINTEL CORP·Filed 2003·Granted Jun 20, 2006·9 cites·19 claims
- 1664US7121841B2Electrical socket with compressible domed contactsINTEL CORP·Filed 2004·Granted Oct 17, 2006·12 cites·18 claims
- 1760US7797826B2Method of power-ground plane partitioning to utilize channel/trenchesINTEL CORP·Filed 2007·Granted Sep 21, 2010·1 cites·6 claims
- 1855US8299369B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryBRIST GARY A·Filed 2009·Granted Oct 30, 2012·0 cites·11 claims
- 1954US9332643B2Interconnect architecture with stacked flex cableINTEL CORP·Filed 2013·Granted May 3, 2016·0 cites·23 claims
- 2049US7234947B2Electrical socket with compressible domed contactsINTEL CORP·Filed 2006·Granted Jun 26, 2007·2 cites·23 claims
- 2147US8307548B2Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the methodALGER WILLIAM O·Filed 2010·Granted Nov 13, 2012·0 cites·14 claims
- 2246US8056221B2Power-ground plane partitioning and via connection to utilize channel/trenches for power deliveryBRIST GARY A·Filed 2007·Granted Nov 15, 2011·0 cites·6 claims
- 2343US2005063637A1Connecting a component with an embedded optical fiberFiled 2003·Application pending·0 cites
- 2442US2007037432A1Built up printed circuit boardsMERSHON JAYNE L·Filed 2005·Application pending·0 cites
- 2541US2016248210A1Interconnect architecture with stacked flex cableINTEL CORP·Filed 2016·Application pending·0 cites
- 2638US2005208749A1Methods for forming electrical connections and resulting devicesBECKMAN MICHAEL W·Filed 2004·Application pending·0 cites
- 2738US2005063638A1Optical fibers embedded in a printed circuit boardFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →