Inventor · disambiguated record
Harry Sax
Also filed as: SAX HARRY · SAX HARRY WALTER
6 granted patents·6 pending applications·15 citations·filing 2003–2024
71Inventor score
Top patents by PatentIndex Score
12 records- 0180US12040288B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0277US2024371796A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0371US11735534B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0466US7279116B2Method for the wet treatment of disk-like objectsSEZ AG·Filed 2003·Granted Oct 9, 2007·15 cites·15 claims
- 0556US2025062169A1Application of a protective atomic layer deposition (ald) or plasma-enhanced chemical vapor deposition (pecvd) layer on a semiconductor die connected to a substrate via a sintered layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0654US2023274996A1Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0753US2023378011A1Electronic device module and a device module both having an adhesion promoter layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0853US2023064442A1Chip package structure, chip package system, and method of forming a chip package structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0952US12489017B2Method of manufacturing a semiconductor package, die, and die packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1046US8573236B2Apparatus and method for ultrasonic wet treatment of plate-like articlesOBWEGER RAINER·Filed 2008·Granted Nov 5, 2013·0 cites·20 claims
- 1144US11328935B2Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 1242US2020381314A1Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a LeadframeINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →