Inventor · disambiguated record
Mark F. Bregman
Also filed as: BREGMAN MARK · BREGMAN MARK F · BREGMAN MARK FIELDING
14 granted patents·1,739 citations·filing 1988–2010
95Inventor score
Top patents by PatentIndex Score
14 records- 0196US5093879AElectro-optical connectorsIBM·Filed 1990·Granted Mar 3, 1992·218 cites·40 claims
- 0295US6332127B1Systems, methods and computer program products for providing time and location specific advertising via the internetIBM·Filed 1999·Granted Dec 18, 2001·1k cites·39 claims
- 0393US8332947B1Security threat reporting in light of local security toolsBREGMAN MARK·Filed 2006·Granted Dec 11, 2012·58 cites·20 claims
- 0490US4862322ADouble electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetweenBICKFORD HARRY R·Filed 1988·Granted Aug 29, 1989·116 cites·12 claims
- 0588US5189363AIntegrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a testerIBM·Filed 1990·Granted Feb 23, 1993·66 cites·38 claims
- 0687US9148353B1Systems and methods for correlating computing problems referenced in social-network communications with events potentially responsible for the samePASQUA JOSEPH·Filed 2010·Granted Sep 29, 2015·12 cites·20 claims
- 0785US5028983AMultilevel integrated circuit packaging structuresIBM·Filed 1988·Granted Jul 2, 1991·78 cites·24 claims
- 0877US5786986AMulti-level circuit card structureIBM·Filed 1994·Granted Jul 28, 1998·61 cites·24 claims
- 0974US5093890AOptical bus for computer systemsIBM·Filed 1990·Granted Mar 3, 1992·39 cites·25 claims
- 1063US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 1161US5006925AThree dimensional microelectric packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·9 claims
- 1248US5229328AMethod for bonding dielectric mounted conductors to semiconductor chip contact padsIBM·Filed 1992·Granted Jul 20, 1993·17 cites·20 claims
- 1342US5233221AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1991·Granted Aug 3, 1993·11 cites·17 claims
- 1430US5322204AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1993·Granted Jun 21, 1994·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →