Inventor · disambiguated record
Hirochika Kawaguchi
Also filed as: KAWAGUCHI HIROCHIKA
2 granted patents·30 citations·filing 1998–1999
54Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
2 records- 0162US6245599B1Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrateMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 12, 2001·30 cites·17 claims
- 0228US6159766ADesigning method of leadframe tip arrangementMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 12, 2000·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Hirochika Kawaguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →