Inventor · disambiguated record
Ru-Yi Cai
Also filed as: Cai ru-yi
2 granted patents·7 pending applications·0 citations·filing 2021–2024
26Inventor score
Top patents by PatentIndex Score
9 records- 0160US12023893B2Insulated metal substrate and method for manufacturing samePOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Jul 2, 2024·0 cites·12 claims
- 0258US2025116941A1Stitching method for exposure processPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Application pending·0 cites
- 0356US11511521B2Insulated metal substrate and method for manufacturing samePOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·0 cites·9 claims
- 0453US2024379623A1Semiconductor package structure and method for forming the sameAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0551US2025126811A1Semiconductor device and method of manufacturing thereofAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0651US2025279397A1Semiconductor structure and method for manufacturing a semiconductor structureAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0746US2025309203A1Semiconductor structure and manufacturing method thereofAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0846US2025125276A1Package substrate, semiconductor device, and method for forming package substrateAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0943US2024055343A1Semiconductor package structureAP MEMORY TECH CORPORATION·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ru-Yi Cai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →