Inventor · disambiguated record
Richard W. Wensel
Also filed as: WENSEL RICHARD · WENSEL RICHARD W
41 granted patents·3 pending applications·687 citations·filing 1996–2004
98Inventor score
Top patents by PatentIndex Score
44 records- 0193US6316290B1Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 13, 2001·51 cites·9 claims
- 0293US5989941AEncapsulated integrated circuit packagingMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 23, 1999·150 cites·8 claims
- 0388US6117708AUse of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·59 cites·7 claims
- 0485US6921860B2Microelectronic component assemblies having exposed contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·39 cites·63 claims
- 0584US6001672AMethod for transfer molding encapsulation of a semiconductor die with attached heat sinkMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 14, 1999·43 cites·15 claims
- 0679US6417028B2Method and apparatus for removing contaminants on electronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 9, 2002·20 cites·16 claims
- 0778US6555898B2Dam structure for center-bonded chip packageMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·21 cites·29 claims
- 0874US6230719B1Apparatus for removing contaminants on electronic devicesMICRON TECHNOLOGY INC·Filed 1998·Granted May 15, 2001·34 cites·6 claims
- 0968US6473311B1Gate area relief strip for a molded I/C packageMICRO TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·13 cites·39 claims
- 1067US6524960B2Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 25, 2003·8 cites·2 claims
- 1167US6518186B1Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 11, 2003·8 cites·6 claims
- 1267US6291899B1Method and apparatus for reducing BGA warpage caused by encapsulationMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·26 cites·8 claims
- 1366US6576057B2Method and apparatus for application of spray adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 10, 2003·6 cites·37 claims
- 1466US5885854AMethod for application of de-wetting material for glob top applicationsMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 23, 1999·27 cites·10 claims
- 1565US6192956B1Method and apparatus for application of spray adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 27, 2001·6 cites·24 claims
- 1664US6664646B2Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate breakMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 16, 2003·6 cites·17 claims
- 1764US6583504B2Semiconductor die with attached heat sink and transfer moldMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·6 cites·9 claims
- 1862US6444497B2Method and apparatus for reducing BGA warpage caused by encapsulationMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 3, 2002·8 cites·17 claims
- 1961US6404069B2Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 11, 2002·6 cites·6 claims
- 2058US6677681B2Carrier substrate and carrier assembly using residual organic compounds to facilitate gate breakMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 13, 2004·4 cites·6 claims
- 2158US6555412B1Packaged semiconductor chip and method of making sameMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 29, 2003·19 cites·45 claims
- 2258US6545368B2Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 8, 2003·5 cites·20 claims
- 2358US6373132B2Semiconductor die with attached heat sink and transfer moldMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 16, 2002·4 cites·9 claims
- 2457US6096163AMethod and apparatus for application of spray adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 1, 2000·13 cites·24 claims
- 2557US5959349ATransfer molding encapsulation of a semiconductor die with attached heat sinkMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 28, 1999·12 cites·9 claims
- 2656US5963792AUse of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 5, 1999·14 cites·3 claims
- 2755US7384805B2Transfer mold semiconductor packaging processesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 10, 2008·5 cites·30 claims
- 2855US7148083B2Transfer mold semiconductor packaging processesMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 12, 2006·5 cites·11 claims
- 2954US6486004B1Method and apparatus for application of spray adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·2 cites·34 claims
- 3054US6387731B1Method and apparatus for reducing BGA warpage caused by encapsulationMICRON TECHNOLOGY INC·Filed 1999·Granted May 14, 2002·15 cites·23 claims
- 3152US6403387B1Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sinkMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 11, 2002·9 cites·6 claims
- 3251US6869811B2Methods for transfer molding encapsulation of a semiconductor die with attached heat sinkMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 22, 2005·2 cites·5 claims
- 3351US6707165B2Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 16, 2004·2 cites·3 claims
- 3450US6249050B1Encapsulated transfer molding of a semiconductor die with attached heat sinkMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 19, 2001·8 cites·9 claims
- 3550US5969427AUse of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 19, 1999·10 cites·6 claims
- 3647US6734372B2Gate area relief strip for a molded I/C packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·2 cites·33 claims
- 3746US5936310ADe-wetting material for glob top applicationsMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 10, 1999·11 cites·17 claims
- 3843US7061082B2Semiconductor die with attached heat sink and transfer moldMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·0 cites·8 claims
- 3942US6251702B1Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 26, 2001·6 cites·8 claims
- 4042US2004033644A1Methods for transfer molding encapsulation of a semiconductor die with attached heat sinkFiled 2003·Application pending·0 cites
- 4139US7095115B2Circuit substrates, semiconductor packages, and ball grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 22, 2006·0 cites·61 claims
- 4239US2001032706A1Method and apparatus for removing contaminants on electronic devicesFiled 2001·Application pending·0 cites
- 4336US2003205828A9Circuit substrates, semiconductor packages, and ball grid arraysFiled 2001·Application pending·0 cites
- 4434US6030857AMethod for application of spray adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 29, 2000·2 cites·19 claims
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