Inventor · disambiguated record
Michael Rutigliano
Also filed as: RUTIGLIANO MICHAEL · RUTIGLIANO MICHAEL L
22 granted patents·4 pending applications·469 citations·filing 1996–2024
96Inventor score
Top patents by PatentIndex Score
26 records- 0185US9448278B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameINTEL CORP·Filed 2015·Granted Sep 20, 2016·5 cites·18 claims
- 0284US6208514B1Mechanical latch for an electronic cartridgeINTEL CORP·Filed 1998·Granted Mar 27, 2001·51 cites·9 claims
- 0383US9347987B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameSCHROEDER CHRISTOPHER R·Filed 2009·Granted May 24, 2016·13 cites·20 claims
- 0483US5894408AElectronic cartridge which allows differential thermal expansion between components of the cartridgeINTEL CORP·Filed 1998·Granted Apr 13, 1999·53 cites·13 claims
- 0582US11464139B2Conformable heat sink interface with a high thermal conductivityINTEL CORP·Filed 2018·Granted Oct 4, 2022·3 cites·20 claims
- 0682US6381136B1Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridgesINTEL CORP·Filed 2000·Granted Apr 30, 2002·33 cites·41 claims
- 0781US6043983AEMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 1998·Granted Mar 28, 2000·47 cites·13 claims
- 0879US5813876APressure actuated zero insertion force circuit board edge connector socketINTEL CORP·Filed 1996·Granted Sep 29, 1998·38 cites·4 claims
- 0975US6030251AKeyed interlock and mechanical alignment integrated mechanical retention features for PC systemINTEL CORP·Filed 1998·Granted Feb 29, 2000·33 cites·11 claims
- 1075US2025020874A1Stackable photonics die with direct optical interconnectINTEL CORP·Filed 2024·Application pending·0 cites
- 1171US12434504B2Marking systems and methods for fiber-based productsFOOTPRINT INT LLC·Filed 2022·Granted Oct 7, 2025·0 cites·5 claims
- 1269US6046905ADual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridgesINTEL CORP·Filed 1998·Granted Apr 4, 2000·52 cites·6 claims
- 1368US8797053B2Positioning and socketing for semiconductor diceRUTIGLIANO MICHAEL L·Filed 2011·Granted Aug 5, 2014·3 cites·21 claims
- 1468US6217175B1Laser marking process on retro-reflective material for security labelsINTEL CORP·Filed 1998·Granted Apr 17, 2001·25 cites·13 claims
- 1566US6239973B1EMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 2000·Granted May 29, 2001·12 cites·16 claims
- 1665US5973399ATamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridgesINTEL CORP·Filed 1998·Granted Oct 26, 1999·25 cites·10 claims
- 1764US12135460B2Stackable photonics die with direct optical interconnectINTEL CORP·Filed 2020·Granted Nov 5, 2024·0 cites·22 claims
- 1863US6071137APressure actuated zero insertion force circuit board edge connector socketINTEL CORP·Filed 1998·Granted Jun 6, 2000·18 cites·39 claims
- 1961US6515871B1Protection shield for an electronic cartridgeINTEL CORP·Filed 1998·Granted Feb 4, 2003·22 cites·15 claims
- 2060US6449163B1Inboard retention system for processor enclosure assemblies with substrate alignmentINTEL CORP·Filed 1998·Granted Sep 10, 2002·20 cites·19 claims
- 2158US12061230B2Active optical plug to optically or electrically test a photonics packageINTEL CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 2253US6084773AIntergrated processor substrate protective enclosure for use in desktop PC systemsINTEL CORP·Filed 1998·Granted Jul 4, 2000·16 cites·12 claims
- 2347US2022196924A1Pierceable protective cover for photonic connectorsINTEL CORP·Filed 2020·Application pending·0 cites
- 2444US2001000980A1Laser marking process on retro-reflective material for security labelsFiled 2000·Application pending·0 cites
- 2543US2020411408A1Deflected-pillar composite compliant elongated micro-structure thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 2625US6560118B2Injection mold gate concealment by integrating surface recess and cosmetic label attachmentINTEL CORP·Filed 1998·Granted May 6, 2003·0 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Michael Rutigliano files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →