Inventor · disambiguated record
Tetsuya Tao
Also filed as: TAO TETSUYA
5 granted patents·3 pending applications·158 citations·filing 1998–2006
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0186US6756685B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Jun 29, 2004·56 cites·10 claims
- 0278US6432807B1Method of forming solder bumps on a semiconductor device using bump transfer plateNEC CORP·Filed 2000·Granted Aug 13, 2002·24 cites·4 claims
- 0377US6410981B2Vented semiconductor device package having separate substrate, strengthening ring and cap structuresNEC CORP·Filed 1998·Granted Jun 25, 2002·59 cites·1 claims
- 0474US7560372B2Process for making a semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 14, 2009·5 cites·9 claims
- 0570US7170172B2Semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2002·Granted Jan 30, 2007·14 cites·16 claims
- 0637US2002173136A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 0737US2002177295A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 0837US2002173135A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
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