Inventor · disambiguated record
Tetsuo Izawa
Also filed as: IZAWA TETSUO
9 granted patents·216 citations·filing 1977–2004
90Inventor score
Top patents by PatentIndex Score
9 records- 0178US5635426AMethod of making a semiconductor device having a silicide local interconnectFUJITSU LTD·Filed 1995·Granted Jun 3, 1997·63 cites·31 claims
- 0276US6849511B2Semiconductor device and method for fabricating the same including interconnection of two electrodesFUJITSU LTD·Filed 2004·Granted Feb 1, 2005·22 cites·6 claims
- 0374US6784472B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2002·Granted Aug 31, 2004·20 cites·8 claims
- 0472US6706610B2Semiconductor device and fabrication process thereofFUJITSU LTD·Filed 2002·Granted Mar 16, 2004·19 cites·16 claims
- 0570US5296727ADouble gate FET and process for manufacturing sameFUJITSU LTD·Filed 1993·Granted Mar 22, 1994·31 cites·13 claims
- 0663US7005755B2Semiconductor device and fabrication process thereofFUJITSU LTD·Filed 2003·Granted Feb 28, 2006·11 cites·5 claims
- 0759US4091545AMethod for removing water and grease deposit from rolling mill sludgeNIPPON KOKAN KK·Filed 1977·Granted May 30, 1978·11 cites·7 claims
- 0857US5850096AEnhanced semiconductor integrated circuit device with a memory array and a peripheral circuitFUJITSU LTD·Filed 1995·Granted Dec 15, 1998·21 cites·8 claims
- 0955US5843841AFabrication process of a semiconductor integrated circuit device having a local interconnect pattern and a semiconductor integrated circuit device fabricated according to such a fabrication processFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·18 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →