Inventor · disambiguated record

Yang-Chou Lin

Also filed as: LIN YANG-CHOU

3 granted patents·1 pending application·2 citations·filing 2018–2024

57Inventor score

Technology areasH10W

Files withUNITED MICROELECTRONICS CORP4

Top patents by PatentIndex Score

4 records

0187US11450558B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·9 claims
0280US2025079237A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
0374US12183626B2Metal interconnect structure having cap layer with different thicknesses and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
0456US10784153B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →