Inventor · disambiguated record
Seppo J. Lehtonen
Also filed as: LEHTONEN SEPPO J
5 granted patents·1 pending application·36 citations·filing 2002–2022
72Inventor score
Files withUNIV JOHNS HOPKINS6
Top patents by PatentIndex Score
6 records- 0183US6733823B2Method for electroless gold plating of conductive traces on printed circuit boardsUNIV JOHNS HOPKINS·Filed 2002·Granted May 11, 2004·29 cites·22 claims
- 0269US12156338B2Chip packaged batteryUNIV JOHNS HOPKINS·Filed 2022·Granted Nov 26, 2024·0 cites·17 claims
- 0354US6881593B2Semiconductor die adapter and method of usingUNIV JOHNS HOPKINS·Filed 2002·Granted Apr 19, 2005·7 cites·1 claims
- 0438US2008009095A1Advanced Thin Flexible Microelectronic Assemblies and Methods for Making SameUNIV JOHNS HOPKINS·Filed 2007·Application pending·0 cites
- 0533US11067449B2Multispectral imagerUNIV JOHNS HOPKINS·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 0631US9844169B2Ka band multi-chip modulatorUNIV JOHNS HOPKINS·Filed 2015·Granted Dec 12, 2017·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Seppo J. Lehtonen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →