Inventor · disambiguated record
Emmett Hughlett
Also filed as: HUGHLETT EMMETT
4 granted patents·1 pending application·37 citations·filing 2008–2014
76Inventor score
Files withGEORGE GREGORY1JOHNSON HALE1SUSS MICROTEC AG1SUSS MICROTEC INC1SUSS MICROTEC LITHOGRAPHY GMBH1
Top patents by PatentIndex Score
5 records- 0190US8181688B2Apparatus for temporary wafer bonding and debondingJOHNSON HALE·Filed 2010·Granted May 22, 2012·25 cites·16 claims
- 0279US9281229B2Method for thermal-slide debonding of temporary bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Mar 8, 2016·3 cites·16 claims
- 0379US7732320B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Jun 8, 2010·6 cites·33 claims
- 0476US8919412B2Apparatus for thermal-slide debonding of temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Dec 30, 2014·3 cites·15 claims
- 0545US2010089978A1Method and apparatus for wafer bondingSUSS MICROTEC INC·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →