Inventor · disambiguated record
Patrick Gorun
Also filed as: GORUN PATRICK
5 granted patents·60 citations·filing 2008–2014
81Inventor score
Top patents by PatentIndex Score
5 records- 0192US8267143B2Apparatus for mechanically debonding temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Sep 18, 2012·23 cites·11 claims
- 0290US8181688B2Apparatus for temporary wafer bonding and debondingJOHNSON HALE·Filed 2010·Granted May 22, 2012·25 cites·16 claims
- 0379US9281229B2Method for thermal-slide debonding of temporary bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Mar 8, 2016·3 cites·16 claims
- 0476US8919412B2Apparatus for thermal-slide debonding of temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Dec 30, 2014·3 cites·15 claims
- 0576US7703658B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Apr 27, 2010·6 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →