Inventor · disambiguated record
Kazutoshi Tomiyoshi
Also filed as: TOMIYOSHI KAZUTOSHI
48 granted patents·860 citations·filing 1986–2009
99Inventor score
Files withSHINETSU CHEMICAL CO42HOKKO CHEM IND CO2MITSUBISHI ELECTRIC CORP2HAYASHI MASAKI1SONY CORP1
Top patents by PatentIndex Score
48 records- 0194US8013057B2White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor caseSHINETSU CHEMICAL CO·Filed 2009·Granted Sep 6, 2011·15 cites·4 claims
- 0292US4877822AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Oct 31, 1989·42 cites·6 claims
- 0390US4902732AEpoxy resin-based curable compositionsSHINETSU CHEMICAL CO·Filed 1986·Granted Feb 20, 1990·60 cites·13 claims
- 0486US5137940ASemiconductor encapsulating epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1990·Granted Aug 11, 1992·49 cites·4 claims
- 0583US4859722AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Aug 22, 1989·34 cites·17 claims
- 0679US8022137B2Silicone resin composition for optical semiconductor devicesSHINETSU CHEMICAL CO·Filed 2009·Granted Sep 20, 2011·9 cites·4 claims
- 0779US5298548AEpoxy resin composition and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 29, 1994·33 cites·15 claims
- 0878US8013056B2White heat-curable silicone resin composition, optoelectronic part case, and molding methodSHINETSU CHEMICAL CO·Filed 2008·Granted Sep 6, 2011·8 cites·7 claims
- 0978US6569532B2Epoxy resin compositions and premolded semiconductor packagesSONY CORP·Filed 2001·Granted May 27, 2003·27 cites·13 claims
- 1078US5940688AEpoxy resin composition and semiconductor device encapsulated therewithSHINETSU CHEMICAL CO·Filed 1997·Granted Aug 17, 1999·57 cites·10 claims
- 1176US6177489B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1998·Granted Jan 23, 2001·53 cites·11 claims
- 1275US4701479AEpoxy resin-based composition for encapsulation of semiconductor devicesSHINETSU CHEMICAL CO·Filed 1986·Granted Oct 20, 1987·20 cites·2 claims
- 1374US6630745B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Oct 7, 2003·18 cites·9 claims
- 1472US6001901AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1997·Granted Dec 14, 1999·28 cites·9 claims
- 1571US7095125B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 22, 2006·15 cites·9 claims
- 1671US6399677B2Epoxy resin compositions and premolded semiconductor packagesSHINETSU CHEMICAL CO·Filed 2000·Granted Jun 4, 2002·14 cites·13 claims
- 1770US5225484AEpoxy resin compositions and cured products thereofSHINETSU CHEMICAL CO·Filed 1991·Granted Jul 6, 1993·16 cites·11 claims
- 1867US7910638B2Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2009·Granted Mar 22, 2011·1 cites·17 claims
- 1966US5358980ANaphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1994·Granted Oct 25, 1994·25 cites·2 claims
- 2066US5053445AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1989·Granted Oct 1, 1991·12 cites·8 claims
- 2164US5166228AEpoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1991·Granted Nov 24, 1992·18 cites·8 claims
- 2262US6783859B2Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 31, 2004·10 cites·3 claims
- 2362US4701482AEpoxy resin composition for encapsulation of semiconductor devicesSHINETSU CHEMICAL CO·Filed 1986·Granted Oct 20, 1987·28 cites·1 claims
- 2461US9303115B2Thermosetting epoxy resin composition and semiconductor deviceHAYASHI MASAKI·Filed 2009·Granted Apr 5, 2016·2 cites·15 claims
- 2561US7122587B2Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Oct 17, 2006·10 cites·6 claims
- 2660US6518332B2Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Feb 11, 2003·9 cites·12 claims
- 2759US6723452B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2002·Granted Apr 20, 2004·9 cites·16 claims
- 2859US5173544AEpoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1990·Granted Dec 22, 1992·12 cites·10 claims
- 2958US5312878ANaphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resinSHINETSU CHEMICAL CO·Filed 1992·Granted May 17, 1994·19 cites·20 claims
- 3056US6162878ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Dec 19, 2000·21 cites·13 claims
- 3156US5418266AEpoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1994·Granted May 23, 1995·24 cites·10 claims
- 3255US5300588AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1992·Granted Apr 5, 1994·15 cites·8 claims
- 3353US6291556B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Sep 18, 2001·5 cites·10 claims
- 3453US6207296B1Inorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 27, 2001·15 cites·6 claims
- 3551US5162400AEpoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1991·Granted Nov 10, 1992·18 cites·11 claims
- 3649US6297306B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Oct 2, 2001·15 cites·9 claims
- 3748US5250637ASemiconductor encapsulating epoxy resin compositions and semiconductor devicesSHINETSU CHEMICAL CO·Filed 1992·Granted Oct 5, 1993·16 cites·15 claims
- 3846US6231997B1Semiconductor encapsulating epoxy resin compositions, and semiconductor devicesSHINETSU CHEMICAL CO·Filed 1999·Granted May 15, 2001·12 cites·10 claims
- 3946US5935314AInorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Aug 10, 1999·11 cites·6 claims
- 4045US6894091B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted May 17, 2005·1 cites·13 claims
- 4144US5190995ANaphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewithSHINETSU CHEMICAL CO·Filed 1991·Granted Mar 2, 1993·13 cites·16 claims
- 4243US6160078ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1998·Granted Dec 12, 2000·10 cites·20 claims
- 4342US6139978ASemiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1998·Granted Oct 31, 2000·10 cites·2 claims
- 4441US6274251B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1999·Granted Aug 14, 2001·9 cites·12 claims
- 4539US6168872B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1998·Granted Jan 2, 2001·8 cites·20 claims
- 4638US5243058AAllyl or propenyl group-containing naphthalene derivativesSHINETSU CHEMICAL CO·Filed 1992·Granted Sep 7, 1993·1 cites·1 claims
- 4732US6027812AEncapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction productSHINETSU CHEMICAL CO·Filed 1998·Granted Feb 22, 2000·3 cites·4 claims
- 4830US5171869AAllyl or propenyl group-containing naphthalene derivativesSHINETSU CHEMICAL CO·Filed 1992·Granted Dec 15, 1992·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →