Inventor · disambiguated record
Che-Fu Chuang
Also filed as: CHUANG CHE-FU
14 granted patents·1 pending application·4 citations·filing 2016–2024
84Inventor score
Files withWINBOND ELECTRONICS CORP15
Top patents by PatentIndex Score
15 records- 0184US11678484B2Semiconductor structure and manufacturing method thereof and flash memoryWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·12 claims
- 0275US11004805B2Semiconductor device and method of fabricating same including two seal ringsWINBOND ELECTRONICS CORP·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 0372US12471277B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2024·Granted Nov 11, 2025·0 cites·12 claims
- 0470US11877447B2Manufacturing method of semiconductor structure and flash memoryWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 0568US10615087B2Semiconductor wafer with test key structureWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 7, 2020·1 cites·17 claims
- 0661US11974428B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·9 claims
- 0760US2025300017A1Method for forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0856US11839076B2Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 0955US10147730B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 4, 2018·0 cites·10 claims
- 1053US9972631B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·6 claims
- 1152US12190981B2Memory array having error checking and correction circuitWINBOND ELECTRONICS CORP·Filed 2022·Granted Jan 7, 2025·0 cites·18 claims
- 1252US11638378B2Method of fabricating semicondoctor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 1348US11380582B2Semiconductor structure and method for forming ihe sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 1446US10971508B2Integrated circuit and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 1545US11362098B2Method for manufacturing memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →