Inventor · disambiguated record
Liang Zhao
Also filed as: ZHAO LIANG · ZHAO LIANG-HUI
33 granted patents·5 pending applications·332 citations·filing 2004–2023
97Inventor score
Files withSMITH INTERNATIONAL6XUE YAN XUN6CNPC USA CORP5FOXCONN TECH CO LTD4ALPHA & OMEGA SEMICONDUCTOR3
Top patents by PatentIndex Score
38 records- 0196US10287825B2Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elementsSMITH INTERNATIONAL·Filed 2015·Granted May 14, 2019·18 cites·22 claims
- 0296US7100681B1Heat dissipation device having heat pipeFOXCONN TECH CO LTD·Filed 2005·Granted Sep 5, 2006·53 cites·19 claims
- 0395US7269014B1Heat dissipation deviceFOXCONN TECH CO LTD·Filed 2006·Granted Sep 11, 2007·39 cites·14 claims
- 0494US12031384B2Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elementsSCHLUMBERGER TECHNOLOGY CORP·Filed 2021·Granted Jul 9, 2024·3 cites·19 claims
- 0594US11215012B2Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elementsSMITH INTERNATIONAL·Filed 2019·Granted Jan 4, 2022·8 cites·22 claims
- 0694US10125552B2Convex ridge type non-planar cutting tooth and diamond drill bitCNPC USA CORP·Filed 2016·Granted Nov 13, 2018·17 cites·19 claims
- 0792US7542293B2Thermal moduleFU ZHUN PRECISION IND SHENZHEN·Filed 2006·Granted Jun 2, 2009·24 cites·4 claims
- 0891US8436429B2Stacked power semiconductor device using dual lead frame and manufacturing methodXUE YAN XUN·Filed 2011·Granted May 7, 2013·13 cites·10 claims
- 0991US7333333B2Locking device for heat sinkFU ZHUN PRECISION IND SHENZHEN·Filed 2005·Granted Feb 19, 2008·22 cites·19 claims
- 1090US10563464B2Convex ridge type non-planar cutting tooth and diamond drill bitCNPC USA CORP·Filed 2018·Granted Feb 18, 2020·7 cites·20 claims
- 1190US8952509B1Stacked multi-chip bottom source semiconductor device and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Feb 10, 2015·15 cites·15 claims
- 1290US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 1387US7116556B2Heat sink mounting apparatusFOXCONN TECH CO LTD·Filed 2004·Granted Oct 3, 2006·45 cites·27 claims
- 1485US8841167B1Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFETGONG YUPING·Filed 2013·Granted Sep 23, 2014·8 cites·8 claims
- 1585US8519520B2Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing methodGONG YUPING·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 1679US7943424B1Encapsulation method for packaging semiconductor components with external leadsALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted May 17, 2011·8 cites·7 claims
- 1778US8076183B2Method of attaching an interconnection plate to a semiconductor die within a leadframe packageXUE YAN XUN·Filed 2009·Granted Dec 13, 2011·7 cites·21 claims
- 1875US10105824B2Chemical leaching/thermal decomposing carbonate in carbonate PCDSMITH INTERNATIONAL·Filed 2014·Granted Oct 23, 2018·2 cites·18 claims
- 1974US9196534B2Method for preparing semiconductor devices applied in flip chip technologyALPHA & OMEGA SEMICONDUCTOR·Filed 2013·Granted Nov 24, 2015·4 cites·16 claims
- 2072US8933518B2Stacked power semiconductor device using dual lead frameXUE YAN XUN·Filed 2013·Granted Jan 13, 2015·3 cites·7 claims
- 2167US9391005B2Method for packaging a power device with bottom source electrodeXUE YAN XUN·Filed 2013·Granted Jul 12, 2016·2 cites·5 claims
- 2267US7493937B2Heat sink mounting deviceFU ZHUN PRECISION IND SHENZHEN·Filed 2004·Granted Feb 24, 2009·13 cites·2 claims
- 2365US8865523B2Semiconductor package and fabrication method thereofHO YUEH-SE·Filed 2013·Granted Oct 21, 2014·1 cites·8 claims
- 2456US12220789B2High-rotational speed cup-shaped grinding wheelGUILIN CHAMPION UNION DIAMOND CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
- 2555US12221906B2System and method for realizing transformation of thermal power unit based on combined high-parameter and low-parameter molten saltsXIAN THERMAL POWER RES INST CO·Filed 2023·Granted Feb 11, 2025·0 cites·7 claims
- 2654US11306542B2Thermally stable polycrystalline diamond and methods of making the sameSMITH INTERNATIONAL·Filed 2014·Granted Apr 19, 2022·0 cites·24 claims
- 2754US9281265B2Packaging structure of a semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Mar 8, 2016·0 cites·9 claims
- 2854US2020181985A1Polycrystalline diamond compact cutter with improved geometry for cooling and cutting evacuation and efficiencyCNPC USA CORP·Filed 2020·Application pending·0 cites
- 2951US10350733B2Ultra-hard material cutting elements and methods of manufacturing the same with a metal-rich intermediate layerSMITH INTERNATIONAL·Filed 2015·Granted Jul 16, 2019·0 cites·18 claims
- 3050US8431993B2Semiconductor package for forming a leadframe packageXUE YAN XUN·Filed 2011·Granted Apr 30, 2013·0 cites·3 claims
- 3149US2023294245A1Cooling structure of high-speed cup-shaped wheelGUILIN CHAMPION UNION DIAMOND CO LTD·Filed 2021·Application pending·0 cites
- 3245US9840876B2Polycrystalline diamond compact cutterCNPC USA CORP·Filed 2015·Granted Dec 12, 2017·0 cites·19 claims
- 3345US9422770B2Method for braze joining of carbonate PCDSMITH INTERNATIONAL·Filed 2012·Granted Aug 23, 2016·0 cites·20 claims
- 3443US12491607B2Electroplated steel wire segment-combined grinding wheelSONG JINGXIN·Filed 2020·Granted Dec 9, 2025·0 cites·18 claims
- 3542US2007146995A1Heat dissipation deviceZHAO LIANG-HUI·Filed 2005·Application pending·0 cites
- 3641US2008127463A1Fastener and heat dissipation device using the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 3736US2007051501A1Heat dissipation deviceWU YI-QIANG·Filed 2006·Application pending·0 cites
- 3835US9746403B2Method of testing a polycrystalline diamond compact cutterCNPC USA CORP·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →