Inventor · disambiguated record
Cheng-Heng Kao
Also filed as: KAO CHENG-HENG
6 granted patents·5 pending applications·105 citations·filing 2002–2017
81Inventor score
Top patents by PatentIndex Score
11 records- 0186US6642079B1Process of fabricating flip chip interconnection structureUNIV NAT CENTRAL·Filed 2002·Granted Nov 4, 2003·50 cites·6 claims
- 0278US6602777B1Method for controlling the formation of intermetallic compounds in solder jointsUNIV NAT CENTRAL·Filed 2002·Granted Aug 5, 2003·26 cites·45 claims
- 0377US6744142B2Flip chip interconnection structure and process of making the sameUNIV NAT CENTRAL·Filed 2003·Granted Jun 1, 2004·27 cites·8 claims
- 0475US10332861B2Interconnection structures and methods for making the sameUNIV NAT TAIWAN·Filed 2017·Granted Jun 25, 2019·2 cites·3 claims
- 0552US2016163950A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2014·Application pending·0 cites
- 0649US2018040798A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
- 0745US9786634B2Interconnection structures and methods for making the sameUNIV NAT TAIWAN·Filed 2015·Granted Oct 10, 2017·0 cites·15 claims
- 0837US9666441B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·0 cites·20 claims
- 0937US2005127147A1[method of forming bond microstructure]Filed 2004·Application pending·0 cites
- 1033US2003219623A1Solder joints with low consumption rate of nickel layerFiled 2003·Application pending·0 cites
- 1125US2005104215A1Barrier layers for tin-bearing solder jointsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →