Inventor · disambiguated record
Wei-Jen Wu
Also filed as: WU WEI · WU WEI-JEN
12 granted patents·7 pending applications·37 citations·filing 2002–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5UNITED MICROELECTRONICS CORP3TAIWAN SEMICONDUCTOR MFG2UNIV NAT CENTRAL2HUAWEI DIGITAL POWER TECH CO LTD1
Top patents by PatentIndex Score
19 records- 0193US9443757B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·12 cites·8 claims
- 0292US11908843B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0392US9530871B1Method for fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 27, 2016·9 cites·9 claims
- 0486US2025329695A1Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0586US2025336899A1Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0682US12406970B2Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0782US12381191B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0866US9673053B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·1 cites·3 claims
- 0962US6811955B2Method for photoresist development with improved CDTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·8 cites·21 claims
- 1058US12094624B2Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the sameSUPERMAG TECH SHANGHAI LTD·Filed 2023·Granted Sep 17, 2024·0 cites·8 claims
- 1155US12337348B2Ultrasonic transducerUNICTRON TECH CORPORATION·Filed 2022·Granted Jun 24, 2025·0 cites·19 claims
- 1255US11844289B2Second generation high-temperature superconducting (2G-HTS) tape and fabrication method thereofUNIV SHANGHAI JIAOTONG·Filed 2023·Granted Dec 12, 2023·0 cites·8 claims
- 1348US7172948B2Method to avoid a laser marked area step heightTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Feb 6, 2007·5 cites·26 claims
- 1443US2021026322A1Detection device for spindle of machine tool and detection method for spindle of machine toolIND TECH RES INST·Filed 2019·Application pending·0 cites
- 1543US2007164476A1Contact lithography apparatus and method employing substrate deformationWU WEI·Filed 2007·Application pending·0 cites
- 1643US2022406679A1Method for Producing Power Semiconductor Module and Power Semiconductor ModuleHUAWEI DIGITAL POWER TECH CO LTD·Filed 2022·Application pending·0 cites
- 1740US10414088B2Platform structure for use in low-temperature manufacturing of scaffold for use in tissue engineering and method of low-temperature manufacturing scaffold for use in tissue engineeringUNIV NAT CENTRAL·Filed 2016·Granted Sep 17, 2019·0 cites·18 claims
- 1837US2017190107A1Manufacturing apparatus for use in low-temperature high-speed manufacturing of support structure and manufacturing method for use in low-temperature high-speed manufacturing of support structureUNIV NAT CENTRAL·Filed 2016·Application pending·0 cites
- 1933US2016310928A1Method for performance optimization of protein chip produced under external electric field applied in different direction and device for providing external electric field in different directionNAT APPLIED RES LABORATORIES·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →