Inventor · disambiguated record
Satoshi Kumazawa
Also filed as: KUMAZAWA SATOSHI
8 granted patents·3 pending applications·9 citations·filing 2013–2024
75Inventor score
Files withDISCO CORP11
Top patents by PatentIndex Score
11 records- 0183US9649775B2Workpiece dividing methodDISCO CORP·Filed 2013·Granted May 16, 2017·7 cites·2 claims
- 0275US10177004B2Method of processing waferDISCO CORP·Filed 2018·Granted Jan 8, 2019·2 cites·6 claims
- 0368US2025205824A1Laser processing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0456US12121993B2Method of processing workpiece and laser processing apparatusDISCO CORP·Filed 2022·Granted Oct 22, 2024·0 cites·1 claims
- 0553US2023286079A1Laser processing machine and processing method of workpieceDISCO CORP·Filed 2023·Application pending·0 cites
- 0644US11373907B2Method of manufacturing device chipDISCO CORP·Filed 2019·Granted Jun 28, 2022·0 cites·5 claims
- 0743US11577339B2Optical axis adjusting method for laser processing apparatusDISCO CORP·Filed 2020·Granted Feb 14, 2023·0 cites·14 claims
- 0839US10679897B2Device wafer processing methodDISCO CORP·Filed 2017·Granted Jun 9, 2020·0 cites·15 claims
- 0937US10796926B2Method of manufacturing glass interposerDISCO CORP·Filed 2018·Granted Oct 6, 2020·0 cites·2 claims
- 1035US10354919B2Wafer dividing methodDISCO CORP·Filed 2016·Granted Jul 16, 2019·0 cites·3 claims
- 1133US2016307851A1Method of dividing waferDISCO CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →