Inventor · disambiguated record
Dirk Breuer
Also filed as: BREUER DIRK
12 granted patents·41 citations·filing 2012–2023
86Inventor score
Top patents by PatentIndex Score
12 records- 0196US11105846B1Crack detecting and monitoring system for an integrated circuitGLOBALFOUNDRIES US INC·Filed 2020·Granted Aug 31, 2021·12 cites·20 claims
- 0289US8957524B2Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structureGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 17, 2015·15 cites·17 claims
- 0386US8623754B1Repairing anomalous stiff pillar bumpsRYAN VIVIAN W·Filed 2012·Granted Jan 7, 2014·8 cites·24 claims
- 0476US12341111B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 0575US8829675B2Repairing anomalous stiff pillar bumpsGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 9, 2014·3 cites·22 claims
- 0670US9021894B2Detecting anomalous weak BEOL sites in a metallization systemRYAN VIVIAN W·Filed 2012·Granted May 5, 2015·3 cites·20 claims
- 0766US11652069B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted May 16, 2023·0 cites·15 claims
- 0857US10607947B2Semiconductor device comprising a die seal including long via linesGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 31, 2020·0 cites·16 claims
- 0952US10014234B2Semiconductor device comprising a die seal including long via linesGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 1044US8950269B2Detecting anomalous stiff pillar bumps formed above a metallization systemRYAN VIVIAN W·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 1142US11127674B2Back end of the line metal structure and methodGLOBALFOUNDRIES US INC·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 1236US10340229B2Semiconductor device with superior crack resistivity in the metallization systemGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
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