Inventor · disambiguated record
Yao-Ting Yeh
Also filed as: YEH YAO-TING
9 granted patents·5 pending applications·19 citations·filing 2013–2016
81Inventor score
Top patents by PatentIndex Score
14 records- 0185US9190398B2Method for packaging an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Granted Nov 17, 2015·7 cites·5 claims
- 0284US9449955B2Optical module integrated packageLINGSEN PRECISION IND LTD·Filed 2014·Granted Sep 20, 2016·6 cites·10 claims
- 0375US9647178B2Package structure of optical module having printed shielding layer and its method for packagingLINGSEN PRECISION IND LTD·Filed 2013·Granted May 9, 2017·4 cites·5 claims
- 0466US9312402B2Micro optical package structure with filtration layer and method for making the sameLINGSEN PRECISION IND LTD·Filed 2014·Granted Apr 12, 2016·2 cites·19 claims
- 0551US9905548B2Optical module integrated packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Feb 27, 2018·0 cites·8 claims
- 0651US2015111324A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 0751US2015091024A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 0849US2015028371A1Package structure of optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 0941US2015028357A1Package structure of an optical moduleLINGSEN PRECISION IND LTD·Filed 2013·Application pending·0 cites
- 1039US10003874B2Microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jun 19, 2018·0 cites·20 claims
- 1135US10362377B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
- 1234US10362406B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted Jul 23, 2019·0 cites·12 claims
- 1334US10299046B2MEMS microphone packageLINGSEN PREC INDUSTRIES LTD·Filed 2016·Granted May 21, 2019·0 cites·5 claims
- 1434US2018063616A1Microelectromechanical microphone package structureLINGSEN PREC INDUSTRIES LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →