Inventor · disambiguated record
Sook Woon Chan
Also filed as: CHAN SOOK WOON
7 granted patents·19 citations·filing 2015–2021
77Inventor score
Files withINFINEON TECHNOLOGIES AG7
Top patents by PatentIndex Score
7 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0284US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0371US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0456US11174152B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 0554US11682644B2Semiconductor device with a heterogeneous solder joint and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 0651US10501312B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 0740US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →