Inventor · disambiguated record
Tom A. Kamp
Also filed as: KAMP TOM · KAMP TOM A
22 granted patents·8 pending applications·369 citations·filing 2002–2025
95Inventor score
Top patents by PatentIndex Score
30 records- 0199US9396961B2Integrated etch/clean for dielectric etch applicationsLAM RES CORP·Filed 2015·Granted Jul 19, 2016·105 cites·26 claims
- 0294US9620376B2Self limiting lateral atomic layer etchLAM RES CORP·Filed 2015·Granted Apr 11, 2017·90 cites·16 claims
- 0394US6921724B2Variable temperature processes for tunable electrostatic chuckLAM RES CORP·Filed 2002·Granted Jul 26, 2005·102 cites·26 claims
- 0492US12237203B2System, method, and user interface for edge ring wear compensationLAM RES CORP·Filed 2022·Granted Feb 25, 2025·2 cites·8 claims
- 0592US8852964B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2013·Granted Oct 7, 2014·14 cites·18 claims
- 0686US11031215B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2019·Granted Jun 8, 2021·3 cites·7 claims
- 0785US11710623B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2021·Granted Jul 25, 2023·1 cites·11 claims
- 0885US7851369B2Hardmask trim methodLAM RES CORP·Filed 2006·Granted Dec 14, 2010·9 cites·10 claims
- 0983US12494345B2Pulsing RF coils of a plasma chamber in reverse synchronizationLAM RES CORP·Filed 2021·Granted Dec 9, 2025·1 cites·20 claims
- 1083US10163610B2Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operationLAM RES CORP·Filed 2016·Granted Dec 25, 2018·3 cites·21 claims
- 1182US8901004B2Plasma etch method to reduce micro-loadingKAMP TOM·Filed 2010·Granted Dec 2, 2014·11 cites·18 claims
- 1281US9012243B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2014·Granted Apr 21, 2015·4 cites·15 claims
- 1379US12087561B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2023·Granted Sep 10, 2024·0 cites·6 claims
- 1478US10950454B2Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP methodLAM RES CORP·Filed 2017·Granted Mar 16, 2021·2 cites·16 claims
- 1575US6939811B2Apparatus and method for controlling etch depthLAM RES CORP·Filed 2002·Granted Sep 6, 2005·17 cites·16 claims
- 1674US10714354B2Self limiting lateral atomic layer etchLAM RES CORP·Filed 2017·Granted Jul 14, 2020·2 cites·16 claims
- 1772US2025191962A1System, method, and user interface for edge ring wear compensationLAM RES CORP·Filed 2025·Application pending·0 cites
- 1867US8124540B2Hardmask trim methodKAMP TOM A·Filed 2010·Granted Feb 28, 2012·2 cites·7 claims
- 1964US9711359B2Shadow trim line edge roughness reductionLAM RES CORP·Filed 2015·Granted Jul 18, 2017·1 cites·8 claims
- 2062US2022270863A1Moveable edge rings with reduced capacitance variation for substrate processing systemsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2161US2021287909A1Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp methodLAM RES CORP·Filed 2021·Application pending·0 cites
- 2258US11538713B2System and method for edge ring wear compensationLAM RES CORP·Filed 2018·Granted Dec 27, 2022·0 cites·12 claims
- 2356US9484214B2Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasmaLAM RES CORP·Filed 2014·Granted Nov 1, 2016·0 cites·24 claims
- 2454US2022254612A1Moveable edge rings with reduced capacitance variation for substrate processing systemsLAM RES CORP·Filed 2020·Application pending·0 cites
- 2553US10431426B2Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systemsLAM RES CORP·Filed 2016·Granted Oct 1, 2019·0 cites·10 claims
- 2644US2023178344A1Evaporative cooling of electrostatic chucksLAM RES CORP·Filed 2021·Application pending·0 cites
- 2744US2016181111A1Silicon etch and cleanLAM RES CORP·Filed 2014·Application pending·0 cites
- 2842US10600648B2Silicon-based deposition for semiconductor processingLAM RES CORP·Filed 2017·Granted Mar 24, 2020·0 cites·20 claims
- 2939US2019189447A1Method for forming square spacersLAM RES CORP·Filed 2017·Application pending·0 cites
- 3038US2019378725A1Method for transferring a pattern from an organic maskLAM RES CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →