Inventor · disambiguated record
William R. Brasch
Also filed as: BRASCH WILLIAM · BRASCH WILLIAM R
17 granted patents·2 pending applications·353 citations·filing 1978–2024
95Inventor score
Top patents by PatentIndex Score
19 records- 0192US4378270AMethod of etching circuit boards and recovering copper from the spent etch solutionsLEARONAL INC·Filed 1981·Granted Mar 29, 1983·51 cites·11 claims
- 0288US5302278ACyanide-free plating solutions for monovalent metalsLEARONAL INC·Filed 1993·Granted Apr 12, 1994·43 cites·28 claims
- 0386US5750018ACyanide-free monovalent copper electroplating solutionsLEARONAL INC·Filed 1997·Granted May 12, 1998·52 cites·20 claims
- 0485US5256275AElectroplated gold-copper-silver alloysLEARONAL INC·Filed 1992·Granted Oct 26, 1993·35 cites·35 claims
- 0576US5085744AElectroplated gold-copper-zinc alloysLEARONAL INC·Filed 1990·Granted Feb 4, 1992·23 cites·42 claims
- 0673US4233344AMethod of improving the adhesion of electroless metal deposits employing colloidal copper activatorLEARONAL INC·Filed 1978·Granted Nov 11, 1980·20 cites·5 claims
- 0766US4847114APreparation of printed circuit boards by selective metallizationLEARONAL INC·Filed 1988·Granted Jul 11, 1989·26 cites·33 claims
- 0862US4399006ASilver platingLEARONAL INC·Filed 1979·Granted Aug 16, 1983·11 cites·6 claims
- 0960US4762560ACopper colloid and method of activating insulating surfaces for subsequent electroplatingLEARONAL INC·Filed 1987·Granted Aug 9, 1988·18 cites·16 claims
- 1059USRE35513ECyanide-free plating solutions for monovalent metalsLEARONAL INC·Filed 1996·Granted May 20, 1997·12 cites·29 claims
- 1158US4877450AFormaldehyde-free electroless copper plating solutionsLEARONAL INC·Filed 1989·Granted Oct 31, 1989·17 cites·22 claims
- 1257US4247372ASilver platingLEARONAL INC·Filed 1978·Granted Jan 27, 1981·9 cites·7 claims
- 1356US2025089149A1Pre-heating of the filament of an xray tubeSPELLMAN HIGH VOLTAGE ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1452US5522972ANickel hypophosphite manufactureLEARONAL INC·Filed 1994·Granted Jun 4, 1996·9 cites·38 claims
- 1550US4759952AProcess for printed circuit board manufactureLEARONAL INC·Filed 1986·Granted Jul 26, 1988·14 cites·23 claims
- 1642US4681630AMethod of making copper colloid for activating insulating surfacesLEARONAL INC·Filed 1986·Granted Jul 21, 1987·9 cites·17 claims
- 1735US2004253450A1Formaldehyde-free electroless copper plating process and solution for use in the processSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1829US5480517AElectrolytic production of hypophosphorous acidLEARONAL INC·Filed 1994·Granted Jan 2, 1996·1 cites·20 claims
- 1929US4761304AProcess for printed circuit board manufactureLEARONAL INC·Filed 1987·Granted Aug 2, 1988·3 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →