Inventor · disambiguated record
Cheul-Joong Youn
Also filed as: YOUN CHEUL-JOONG
4 granted patents·8 pending applications·32 citations·filing 2004–2011
75Inventor score
Top patents by PatentIndex Score
12 records- 0180US8053881B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·10 cites·5 claims
- 0276US7495315B2Method and apparatus of fabricating a semiconductor device by back grinding and dicingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 24, 2009·5 cites·5 claims
- 0363US6984877B2Bumped chip carrier package using lead frame and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 10, 2006·14 cites·11 claims
- 0451US2009309206A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0550US7323397B2Method and apparatus of fabricating a semiconductor device by back grinding and dicingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 29, 2008·3 cites·19 claims
- 0645US2009014876A1Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0745US2011244634A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 0844US2007007634A1Method for manufacturing semiconductor chip packageYOUN CHEUL-JOONG·Filed 2006·Application pending·0 cites
- 0944US2008308935A1Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1042US2009079052A1Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1138US2005242417A1Semiconductor chip package and method for manufacturing the sameYOUN CHEUL-JOONG·Filed 2004·Application pending·0 cites
- 1234US2005023659A1Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common planeFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →