Inventor · disambiguated record
Antonio Arion Gellineau
Also filed as: GELLINEAU ANTONIO · GELLINEAU ANTONIO A · Gellineau Antonio Arion
22 granted patents·3 pending applications·149 citations·filing 2013–2022
94Inventor score
Top patents by PatentIndex Score
25 records- 0198US10352695B2X-ray scatterometry metrology for high aspect ratio structuresKLA TENCOR CORP·Filed 2016·Granted Jul 16, 2019·68 cites·21 claims
- 0297US11145559B2Process monitoring of deep structures with X-ray scatterometryKLA CORP·Filed 2020·Granted Oct 12, 2021·4 cites·12 claims
- 0397US10775323B2Full beam metrology for X-ray scatterometry systemsKLA TENCOR CORP·Filed 2017·Granted Sep 15, 2020·19 cites·21 claims
- 0497US10727142B2Process monitoring of deep structures with X-ray scatterometryKLA TENCOR CORP·Filed 2018·Granted Jul 28, 2020·17 cites·13 claims
- 0595US11519719B2Transmission small-angle X-ray scattering metrology systemKLA CORP·Filed 2020·Granted Dec 6, 2022·3 cites·20 claims
- 0694US10481111B2Calibration of a small angle X-ray scatterometry based metrology systemKLA TENCOR CORP·Filed 2017·Granted Nov 19, 2019·11 cites·22 claims
- 0792US11099137B2Visualization of three-dimensional semiconductor structuresKLA CORP·Filed 2020·Granted Aug 24, 2021·3 cites·21 claims
- 0891US11313816B2Full beam metrology for x-ray scatterometry systemsKLA CORP·Filed 2020·Granted Apr 26, 2022·2 cites·19 claims
- 0990US11698251B2Methods and systems for overlay measurement based on soft X-ray ScatterometryKLA CORP·Filed 2020·Granted Jul 11, 2023·2 cites·22 claims
- 1088US12360062B1Methods and systems for regularizing the optimization of application specific semiconductor measurement system parameter settingsKLA CORP·Filed 2022·Granted Jul 15, 2025·2 cites·23 claims
- 1187US10767978B2Transmission small-angle X-ray scattering metrology systemKLA TENCOR CORP·Filed 2018·Granted Sep 8, 2020·4 cites·20 claims
- 1285US10816486B2Multilayer targets for calibration and alignment of X-ray based measurement systemsKLA TENCOR CORP·Filed 2019·Granted Oct 27, 2020·2 cites·28 claims
- 1385US10794839B2Visualization of three-dimensional semiconductor structuresKLA TENCOR CORP·Filed 2019·Granted Oct 6, 2020·4 cites·21 claims
- 1483US11073487B2Methods and systems for characterization of an x-ray beam with high spatial resolutionKLA TENCOR CORP·Filed 2018·Granted Jul 27, 2021·3 cites·35 claims
- 1583US10983227B2On-device metrology using target decompositionKLA TENCOR CORP·Filed 2018·Granted Apr 20, 2021·3 cites·20 claims
- 1679US12320763B2Full beam metrology for x-ray scatterometry systemsKLA CORP·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1773US11955391B2Process monitoring of deep structures with X-ray scatterometryKLA CORP·Filed 2021·Granted Apr 9, 2024·0 cites·12 claims
- 1870US10504759B2Semiconductor metrology with information from multiple processing stepsKLA TENCOR CORP·Filed 2017·Granted Dec 10, 2019·1 cites·20 claims
- 1958US9267963B2Interferometric atomic-force microscopy device and methodUNIV LELAND STANFORD JUNIOR·Filed 2013·Granted Feb 23, 2016·1 cites·20 claims
- 2053US12019030B2Methods and systems for targeted monitoring of semiconductor measurement qualityKLA CORP·Filed 2022·Granted Jun 25, 2024·0 cites·19 claims
- 2150US11519869B2Methods and systems for real time measurement controlKLA TENCOR CORP·Filed 2019·Granted Dec 6, 2022·0 cites·18 claims
- 2248US11990380B2Methods and systems for combining x-ray metrology data sets to improve parameter estimationKLA CORP·Filed 2020·Granted May 21, 2024·0 cites·17 claims
- 2345US2023169255A1Methods And Systems For Data Driven Parameterization And Measurement Of Semiconductor StructuresKLA CORP·Filed 2022·Application pending·0 cites
- 2444US2014130214A1Monolithic interferometric atomic force microscopy deviceUNIV LELAND STANFORD JUNIOR·Filed 2013·Application pending·0 cites
- 2542US2020025554A1System, method and computer program product for fast automatic determination of signals for efficient metrologyKLA TENCOR CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →