Inventor · disambiguated record
I-Ching Lin
Also filed as: LIN I-CHING
5 granted patents·1 pending application·14 citations·filing 2007–2015
74Inventor score
Top patents by PatentIndex Score
6 records- 0186US8222139B2Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneouslyCHEN MING-FA·Filed 2010·Granted Jul 17, 2012·9 cites·10 claims
- 0269US8546886B2Controlling the device performance by forming a stressed backside dielectric layerCHEN MING-FA·Filed 2011·Granted Oct 1, 2013·2 cites·20 claims
- 0366US9236311B2Controlling the device performance by forming a stressed backside dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jan 12, 2016·1 cites·20 claims
- 0453US8946084B2Controlling the device performance by forming a stressed backside dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·0 cites·17 claims
- 0546US8084361B2Semiconductor fabrication method suitable for MEMSHUANG TSUNG-CHENG·Filed 2007·Granted Dec 27, 2011·2 cites·20 claims
- 0646US2012258590A1Chemical mechanical polishing (cmp) processing of through-silicon via (tsv) and contact plug simultaneouslyCHEN MING-FA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →