Inventor · disambiguated record
Deepak Kulkarni
Also filed as: KULKARNI DEEPAK · KULKARNI DEEPAK V · KULKARNI DEEPAK VASANT
21 granted patents·24 pending applications·266 citations·filing 2009–2025
95Inventor score
Top patents by PatentIndex Score
45 records- 0199US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0297US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 0397US9153552B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2014·Granted Oct 6, 2015·43 cites·8 claims
- 0497US8912670B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2012·Granted Dec 16, 2014·53 cites·10 claims
- 0596US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 0695US11990427B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2022·Granted May 21, 2024·2 cites·15 claims
- 0795US11973041B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2021·Granted Apr 30, 2024·2 cites·41 claims
- 0894US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 0994US9520376B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2015·Granted Dec 13, 2016·11 cites·7 claims
- 1093US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 1191US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 1291US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 1385US12308329B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 1483US11984396B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1583US2025253265A1Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2025·Application pending·0 cites
- 1682US12107042B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1780US9496211B2Logic die and other components embedded in build-up layersINTEL CORP·Filed 2012·Granted Nov 15, 2016·5 cites·17 claims
- 1877US2023343774A1Techniques for die tilingINTEL CORP·Filed 2023·Application pending·0 cites
- 1975US11769735B2Chiplet first architecture for die tiling applicationsINTEL CORP·Filed 2019·Granted Sep 26, 2023·1 cites·25 claims
- 2075US10453799B2Logic die and other components embedded in build-up layersINTEL CORP·Filed 2016·Granted Oct 22, 2019·2 cites·15 claims
- 2175US2025029900A1Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 2272US2022238506A1Techniques for die tilingINTEL CORP·Filed 2022·Application pending·0 cites
- 2371US9601421B2BBUL material integration in-plane with embedded die for warpage controlTEH WENG HONG·Filed 2011·Granted Mar 21, 2017·3 cites·11 claims
- 2471US2022115367A1Techniques for die tilingINTEL CORP·Filed 2021·Application pending·0 cites
- 2569US12080632B2Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2021·Granted Sep 3, 2024·0 cites·13 claims
- 2664US10796988B2Localized high density substrate routingINTEL CORP·Filed 2018·Granted Oct 6, 2020·0 cites·14 claims
- 2762US9808875B2Methods of fabricating low melting point solder reinforced sealant and structures formed therebyINTEL CORP·Filed 2016·Granted Nov 7, 2017·0 cites·8 claims
- 2861US2025306316A1Integrated photonics circuitryADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 2960US2024404897A1Chip complex with embedded interposerADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3060US2024212908A1Through-magnetic inductorADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3160US2024371714A1Chip package with a glass interposerADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3259US2025149525A1Chip package with active silicon bridgeADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3358US2025079328A1Molded core substrate for embedding componentsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3458US2025132270A1Chip package with tamper preventionADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3557US2025343039A1Systems and methods for preventing body biasing injection attacksADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3657US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3756US2024234304A1Chip package with core embedded chipletADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3856US2019312019A1Techniques for die tilingINTEL CORP·Filed 2018·Application pending·0 cites
- 3956US2025349754A1Systems and methods for preventing fault injection attacks through a back side of a dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 4055US9254532B2Methods of fabricating low melting point solder reinforced sealant and structures formed therebyKULKARNI DEEPAK V·Filed 2009·Granted Feb 9, 2016·0 cites·12 claims
- 4154US2024006290A1Lth and svlc hybrid core architecture for lower cost component embedding in package substrateADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 4253US2024047229A1Organic package core for a substrate with high density plated holesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 4351US2024047228A1Methods for constructing package substrates with high densityADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 4446US2022199503A1Novel lga architecture for improving reliability performance of metal defined padsINTEL CORP·Filed 2020·Application pending·0 cites
- 4546US2021391264A1Microelectronic structures including bridgesINTEL CORP·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Deepak Kulkarni files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →