Inventor · disambiguated record
John Ni
Also filed as: NI JOHN QIANG · Ni john
7 granted patents·47 citations·filing 1999–2016
83Inventor score
Top patents by PatentIndex Score
7 records- 0189US8153474B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Apr 10, 2012·10 cites·15 claims
- 0270US8759965B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Jun 24, 2014·2 cites·27 claims
- 0369US8560104B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Oct 15, 2013·2 cites·18 claims
- 0469US8283769B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Oct 9, 2012·2 cites·20 claims
- 0563US8639373B2Modular low stress package technologyROTAY CRAIG J·Filed 2010·Granted Jan 28, 2014·1 cites·22 claims
- 0661US6214152B1Lead frame moisture barrier for molded plastic electronic packagesRJR POLYMERS INC·Filed 1999·Granted Apr 10, 2001·30 cites·16 claims
- 0728US10115605B2Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing ratesRJR TECH INC·Filed 2016·Granted Oct 30, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →