Inventor · disambiguated record
Hirohito Ohhata
Also filed as: OHHATA HIROHITO
5 granted patents·1 pending application·664 citations·filing 1994–2003
87Inventor score
Files withHITACHI CHEMICAL CO LTD5
Top patents by PatentIndex Score
6 records- 0198US5976912AFabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 2, 1999·519 cites·4 claims
- 0294US7187072B2Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2003·Granted Mar 6, 2007·52 cites·9 claims
- 0391US6365432B1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 2, 2002·41 cites·4 claims
- 0487US6746897B2Fabrication process of semiconductor package and semiconductor packageFiled 2001·Granted Jun 8, 2004·27 cites·14 claims
- 0555US5504992AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 9, 1996·25 cites·3 claims
- 0641US2002094606A1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →