Inventor · disambiguated record
Chi-Liang Pan
Also filed as: PAN CHI-LIANG
4 granted patents·1 pending application·40 citations·filing 2008–2019
73Inventor score
Top patents by PatentIndex Score
5 records- 0187US10276545B1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 30, 2019·19 cites·20 claims
- 0284US7894172B2ESD protection structureIND TECH RES INST·Filed 2008·Granted Feb 22, 2011·14 cites·28 claims
- 0375US7649723B2ESD protection substrate and integrated circuit utilizing the sameIND TECH RES INST·Filed 2008·Granted Jan 19, 2010·7 cites·18 claims
- 0440US10177077B2Chip structure having redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 0537US2020312734A1Semiconductor package with an internal heat sink and method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →