Inventor · disambiguated record
Ryuji Hosokawa
Also filed as: HOSOKAWA RYUJI
8 granted patents·130 citations·filing 1994–2011
86Inventor score
Top patents by PatentIndex Score
8 records- 0181US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 0275US6734541B2Semiconductor laminated moduleTOSHIBA KK·Filed 2002·Granted May 11, 2004·26 cites·8 claims
- 0374US5543658AMethod of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor deviceTOSHIBA KK·Filed 1994·Granted Aug 6, 1996·51 cites·6 claims
- 0469US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 0568US5614441AProcess of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated packageTOSHIBA KK·Filed 1995·Granted Mar 25, 1997·39 cites·4 claims
- 0665US7298035B2Semiconductor device and a method of assembling a semiconductor deviceTOSHIBA KK·Filed 2005·Granted Nov 20, 2007·3 cites·9 claims
- 0752US8759971B2Semiconductor apparatusHOSOKAWA RYUJI·Filed 2011·Granted Jun 24, 2014·1 cites·16 claims
- 0852US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →