Inventor · disambiguated record
Dong Hwi Shin
Also filed as: SHIN DONG HWI
24 granted patents·2 pending applications·81 citations·filing 2006–2024
93Inventor score
Top patents by PatentIndex Score
26 records- 0197US10395840B1Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 27, 2019·27 cites·14 claims
- 0296US11315732B2Multi-layer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 26, 2022·7 cites·22 claims
- 0395US11657975B2Multi-layer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted May 23, 2023·3 cites·16 claims
- 0495US10354802B1Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 16, 2019·19 cites·15 claims
- 0594US11282646B2Multilayer ceramic electronic component having effective coverage of external electrodeSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 0692US11081281B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 3, 2021·6 cites·15 claims
- 0791US11393627B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 0891US10395839B1Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 27, 2019·5 cites·20 claims
- 0989US10832869B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 10, 2020·3 cites·12 claims
- 1088US11769631B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 26, 2023·1 cites·20 claims
- 1185US10879006B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 29, 2020·2 cites·13 claims
- 1281US12142433B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 12, 2024·0 cites·9 claims
- 1379US11978594B2Multi-layer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted May 7, 2024·0 cites·10 claims
- 1476US11139114B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 5, 2021·1 cites·23 claims
- 1575US12224121B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 11, 2025·0 cites·12 claims
- 1672US11837412B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 5, 2023·0 cites·16 claims
- 1768US11784002B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 1868US11763987B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 19, 2023·0 cites·12 claims
- 1965US2023084504A1Multilayer ceramic electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 2063US11335506B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted May 17, 2022·0 cites·12 claims
- 2163US11101074B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 24, 2021·0 cites·13 claims
- 2262US11527359B2Multilayer ceramic electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 13, 2022·0 cites·26 claims
- 2352US2025044375A1Method for measuring dc bias aging characteristics of multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2450US11664164B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 2550US11107633B2Ceramic electronic component having external electrode including electrode layer and conductive resin layerSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 31, 2021·0 cites·18 claims
- 2637US7815399B2Method of mechanized construction for earth wire under-bracing and extendable excavating unit for auger craneDAEWON ELECTRIC CO LTD·Filed 2006·Granted Oct 19, 2010·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →