Inventor · disambiguated record
Woraya Benjavasukul
Also filed as: BENJAVASUKUL WORAYA
5 granted patents·15 citations·filing 2009–2017
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0182US9773722B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Sep 26, 2017·4 cites·20 claims
- 0279US8367476B2Metallic solderability preservation coating on metal part of semiconductor package to prevent oxideUTAC THAI LTD·Filed 2009·Granted Feb 5, 2013·11 cites·25 claims
- 0349US10204850B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Feb 12, 2019·0 cites·17 claims
- 0444US8569877B2Metallic solderability preservation coating on metal part of semiconductor package to prevent oxideBENJAVASUKUL WORAYA·Filed 2009·Granted Oct 29, 2013·0 cites·15 claims
- 0540US8431443B2Metallic solderability preservation coating on metal part of semiconductor package to prevent oxideBENJAVASUKUL WORAYA·Filed 2011·Granted Apr 30, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →