Inventor · disambiguated record
Yu-Bey Wu
Also filed as: WU YU-BEY
17 granted patents·43 pending applications·41 citations·filing 2013–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD58TAIWAN SEMICONDUCTOR MANFACTURING CO LTD1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
60 records- 0195US9653348B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
- 0287US9377680B2Method and apparatus for integrated circuit layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·4 cites·20 claims
- 0386US10157843B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 0486US9852992B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·3 cites·20 claims
- 0586US2025359000A1Static Random-Access Memory Device with Enhanced Isolation Structure and Increased Packing DensityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0684US10879179B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·2 cites·20 claims
- 0784US9881870B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·3 cites·20 claims
- 0883US11081445B2Semiconductor device comprising air gaps having different configurationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·20 claims
- 0981US2025359172A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1081US2025365915A1Multi-port sram cell with enlarged contact viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1180US2025351323A1Multi-port sram cell with dual side power railsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1279US2025351321A1Static random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1378US2025357429A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1478US2025351324A1Reduction of size of edge cell region in memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1577US2025364375A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1677US2025048613A1Static Random-Access Memory Device with Enhanced Isolation Structure and Increased Packing DensityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1776US2025349676A1Semiconductor structure with backside through substrate thermal conductive viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1876US2025349675A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1976US2025357274A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2075US9995998B2Method and apparatus for integrated circuit layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·20 claims
- 2175US2025343129A1Embedded passive devices for integrated circuits and methods of forming the sameTAIWAN SEMICONDUCTOR MANFACTURING CO LTD·Filed 2025·Application pending·0 cites
- 2275US2025336894A1Packages with dtcs on other device dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2375US2025349774A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2475US2025336858A1Methods of forming metal ion barrier layers and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2575US2025336751A1Heat dissipating structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2674US2025294716A1Static random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2774US2025107207A1Semiconductor Device Structure with Uneven Gate ProfileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2874US2024363635A1Semiconductor device with varying gate dimensions and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2973US11355436B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 3072US2025316628A1Semiconductor structure with bonding interface and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3172US2025048612A1Reduction of size of edge cell region in memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3272US2025149427A1Embedded passive devices for integrated circuits and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3371US12166096B2Semiconductor device structure with uneven gate profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3471US11676895B2Semiconductor device comprising air gaps having different configurationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 3571US2025126839A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3670US12205907B2Seal ring structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 3770US2025046756A1Interconnect Structure for Front-to-Front Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3870US2024414907A1Multi-port sram cell with dual side power railsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3970US2024397693A1Multi-port sram cell with enlarged contact viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4070US2025046678A1Semiconductor structure with backside through substrate thermal conductive viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4170US2025149482A1Semiconductor structure with bonding interface and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4270US2025210462A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4370US2025087639A1Packages with dtcs on other device dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4469US2025038074A1Semiconductor devices with backside interconnect structure and through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4569US2025336770A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4669US2025046667A1Heat Dissipating Structure and Methods of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4768US2025070064A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4868US2024355766A1Methods of forming metal ion barrier layers and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4967US12080715B2Semiconductor device with varying gate dimensions and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 5067US2025374620A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →