Inventor · disambiguated record
Yi-Chao Mao
Also filed as: Mao yi-chao
24 granted patents·4 pending applications·2,467 citations·filing 2011–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21TAIWAN SEMICONDUCTOR MFG3HUNG JUI-PIN1LIN JING-CHENG1Mao yi chao1
Top patents by PatentIndex Score
28 records- 0199US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 0298US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 0398US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 0492US9847269B2Fan-out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·14 cites·20 claims
- 0590US2025364462A1Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0687US10672631B2Method and system for substrate thinningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·3 cites·20 claims
- 0785US10518387B2Grinding element, grinding wheel and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·4 cites·19 claims
- 0884US12482773B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 0983US9312148B2Method of packaging a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 12, 2016·3 cites·20 claims
- 1081US11239180B2Structure and formation method of package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 1, 2022·2 cites·20 claims
- 1180US12131965B2Apparatus for detecting end pointTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1279US11996375B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1379US2025349620A1Method of Singulating a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1474US12255155B2Package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 1574US11728190B2System for thinning substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1673US2025174578A1Package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1772US11616034B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1871US11056364B2Method for substrate thinningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 1970US12500124B2Method of singulating a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 2069US11862523B2Apparatus for detecting end pointTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 2164US9698121B2Methods and structures for packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·1 cites·20 claims
- 2261US10964609B2Apparatus and method for detecting end pointTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2354US9406598B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
- 2453US2024203764A1Wafer-level die-transfer tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2552US11069653B2Methods and structures for packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 20, 2021·0 cites·20 claims
- 2643US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
- 2739US9358660B2Grinding wheel design with elongated teeth arrangementTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 2838US9960088B2End point detection in grindingMao yi chao·Filed 2011·Granted May 1, 2018·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →