Inventor · disambiguated record
Anton Pugatschow
Also filed as: PUGATSCHOW ANTON
4 granted patents·3 pending applications·18 citations·filing 2010–2025
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
- 0271US10115688B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·2 cites·18 claims
- 0354US10573611B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 0453US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 0542US2015228607A1Layer stacks and integrated circuit arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 0642US2012068345A1Layer stacks and integrated circuit arrangementsSCHMIDT TOBIAS·Filed 2010·Application pending·0 cites
- 0741US2025273633A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Anton Pugatschow files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →