Inventor · disambiguated record
Tetsuya Kogiso
Also filed as: KOGISO TETSUYA
6 granted patents·2 pending applications·8 citations·filing 2007–2017
73Inventor score
Top patents by PatentIndex Score
8 records- 0177US8828525B2Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plateKIDO MASAYOSHI·Filed 2011·Granted Sep 9, 2014·2 cites·25 claims
- 0272US9835942B2Photosensitive resin composition and use thereofSEKITO YOSHIHIDE·Filed 2011·Granted Dec 5, 2017·2 cites·14 claims
- 0369US9081276B2Photosensitive resin composition production kit, and use thereofKODA TOMOHIRO·Filed 2011·Granted Jul 14, 2015·2 cites·7 claims
- 0466US8754186B2Polyimide precursor composition, use thereof and production method thereofFUJIHARA KAN·Filed 2007·Granted Jun 17, 2014·2 cites·14 claims
- 0549US10822465B2Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured filmKANEKA CORP·Filed 2016·Granted Nov 3, 2020·0 cites·21 claims
- 0645US2010132989A1Novel polyimide precursor composition and use thereofFUJIHARA KAN·Filed 2008·Application pending·0 cites
- 0743US10975263B2Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing sameKANEKA CORP·Filed 2017·Granted Apr 13, 2021·0 cites·14 claims
- 0832US2020045833A1Printed wiring board and method for manufacturing sameKANEKA CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →